A POI (Piezoelectric on Insulator) substrate achieved by mechanically thinning the surface LN/LT layer of a multilayer bonded substrate to the nanometer level through specialized processing methods. Primarily applied in 5G/6G (high-end SAW filters), optical communications (thin-film electro-optic modulators), sensors, and other fields.
| Project | Specifications |
|---|---|
| film material | Acoustic-grade lithium niobate/lithium tantalate Optical-grade lithium niobate/lithium tantalate |
| Film thickness | 600nm |
| Film Layer TTV | ≤40nm |
| Bend | ≤ 15μm |
| Warpage | ≤20μm |
| Roughness | ≤0.2nm |
| DDP | ≤3% |