A high-precision visual inspection machine specifically designed for magazine-fed operation, featuring automatic loading, visual alignment, simultaneous front-and-back appearance inspection, and automatic unloading. The machine meets Class 100 cleanroom requirements. Widely used for detecting various wafer defects, its unique inspection technology is tailored for wafer manufacturing processes. It effectively detects issues such as cutting fractures, bump/pad scratches, discoloration, missing features, misalignment, deformation, and foreign objects.

● Non-contact, non-destructive visual defect detection. 

● Achieves high-precision blank dimensional measurement using visual methods. 

● Enables high-speed appearance defect inspection. 

● Automatically recognizes wafer QR codes/text (optional feature). 

● Automatically identifies misplaced or missing items in feed trays (optional feature). 

● Compact size, space-saving design, and easy equipment installation. 

● Supports external signal triggering for inline inspection requirements. 

● Utilizes proprietary analysis algorithms optimized for appearance defect detection. 

● Capable of automatically generating J-curve distribution charts (optional feature).