Photolithographic quartz wafers are precision-manufactured using 3-inch or 4-inch quartz wafers as substrates. Through processes including photolithography, etching, fine-tuning, and coating, they are tailored to meet ultra-high frequency, miniaturization (1612 package or smaller), and high stability requirements. These wafers are produced with or without electrodes (for special applications) to fulfill diverse packaging and performance specifications. These photolithography wafers undergo dicing, coating (for special requirements), dispensing, fine-tuning, and soldering to form quartz crystal resonators (Xtal). Alternatively, they are combined with related ICs, capacitors, inductors, and other components for packaging into TSX, SPXO, TCXO, OCXO, VCXO, and other devices.