Primarily used in LED packaging, power modules, automotive electronics, RF/microwave communications, imaging, and other fields.
| Project | Specifications |
|---|---|
| External Dimensions | 1 inch - 8 inch |
| Thickness | ≥0.05mm±0.01mm |
| Roughness | ≥10nm |
| Warpage | ≤0.3% |
| TTV | Customizable |