A high-precision wafer thickness tester specifically designed for magazine-fed operation, featuring automatic loading, visual positioning, thickness measurement, distance measurement, and automatic unloading. The machine also meets Class 100 cleanroom requirements.
● Non-contact, non-destructive optical film thickness measurement.
● Achieves high measurement repeatability using spectroscopic interferometry.
● Enables high-speed, real-time grinding inspection.
● Performs measurements through intermediate layers such as protective films and viewports.
● Supports long working distances and facilitates easy integration into production lines or equipment.
● Accommodates external signal triggering requirements for inline inspection.
● Utilizes proprietary analysis algorithms (patent obtained) optimized for film thickness measurement.
● Capable of automatic film thickness distribution mapping (optional feature).
| Project | Specifications |
|---|---|
| Film Thickness Measurement Range | 0.1 μm ~ 1600 μm※1 |
| Film thickness accuracy | ±0.1% or less |
| Repeatability | Less than 0.001% |
| Measurement time | Less than 10 milliseconds |
| Measurement Light Source | Semiconductor light source |
| Measurement diameter | φ27μm※2 |
| WD | 3 mm ~ 200 mm |
| ※1 The thickness measurement range varies depending on the type of spectrometer | ※2 Minimum φ6μm |
| Name | Automatic Mapping System |
| Sample Stage Method | X-Y Stage |
| Optics Department | Measurement Probe CCD Camera |
| Maximum Wafer Size | Less than 150mm |
| Wafer Angle Compensation | There is |
| Pattern Alignment | There is |
| Wafer thickness range | Depending on the design of the optical interferometric wafer thickness sensor |
| Equipment Dimensions | 1000mm×900mm×2000mm |
| Equipment Weight | 750kg |
