A Piezoelectric on Insulator (POI) substrate achieved by mechanically thinning the surface LN/LT layer of a multilayer bonded substrate to the micrometer level through specialized processing methods. Primarily applied in 5G/6G (high-end SAW filters), optical communications (thin-film electro-optic modulators), sensors, and other fields.
| Project | Specifications |
|---|---|
| film material | Acoustic-grade lithium niobate/lithium tantalate Optical-grade lithium niobate/lithium tantalate |
| Film thickness | 10μm |
| TTV | ≤1μm |
| LTV | ≤500nm |
| PLTV | ≥95% |
| BOW | ≤ 15μm |
| Warpage | ≤20μm |
| Roughness | < 0.5nm |
| DDP | ≤3% |