Primarily used for wafer marking and ID marking, this process employs customized lasers to perform localized processing on wafers, revealing patterns, text, barcodes, and other graphics as required to enable wafer traceability. It features high marking precision, rapid processing speed, and clear markings. This technology is mainly applied in the precision surface processing of materials across electronics, machinery, medical, and other industries.

● Automatic loading and unloading system. 

● Equipped with high-precision CCD vision positioning. 

● Optional laser light sources (UV, green, infrared) to accommodate laser marking processes for diverse materials and specifications. 

● Automatic detection of misplaced or missing items in material racks (optional feature). 

● Integration with MES systems (optional feature). 

● Compact design, space-saving, and easy installation.